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Film Capacitors
Metallized Polypropylene Film Capacitors (MKP)
Series/Type: Date:
B32674 ... B32678 May 2009
(c) EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Metallized polypropylene film capacitors (MKP) MKP DC link high power series
B32674 ... B32678
Typical applications For high ripple current modules in: Frequency converters Industrial and high-end power supplies Solar inverters Climatic Max. operating temperature: 105 C (case) Climatic category (IEC 60068-1): 40/100/56 Construction Dielectric: metallized polypropylene (MKP) Plastic case (UL 94 V-0) Epoxy resin sealing (UL 94 V-0) Features Excellent self-healing properties Over-voltage capability Optimized electrical contact High frequency ripple current High reliability Long useful life Terminals Parallel wire leads, lead-free tinned 2-pin and 4-pin versions Standard lead lengths: 6 1 mm Special lead lengths are available on request Marking Manufacturer's logo and lot number, date code, rated capacitance (coded), capacitance tolerance (code letter), rated DC voltage Delivery mode Bulk (untaped, lead length 6
Dimensional drawings 2-pin version
4-pin version
Dimensions in mm Version Lead spacing 0.4 27.5 37.5 52.5 Lead diameter d1 0.8 1.2 1.2 Type
2-pin 4-pin 4-pin
B32674D B32676G B32678G
1 mm)
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Overview of available types Lead spacing 27.5 mm Type Page VR (V DC) CR (F) 0.47 0.68 1.0 1.5 2.2 3.0 3.3 4.0 4.7 5.0 5.6 6.0 6.8 7.5 8.0 8.2 9.0 10 12 14 15 20 22 25 30 35 40 47 60 B32674 4 37.5 mm B32676 6 52.5 mm B32678 8
300 450 630 750 875 300 450 630 750 875 300 450 630 750 875
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 MKP DC link high power series
Ordering codes and packing units (lead spacing 27.5 mm) CR Max. dimensions wxhxl mm P1 Ordering code (composition see below) IRMS,max 70 C 10 kHz A IRMS,max 70 C 20 kHz A 6.5 8.0 9.5 10.0 10.5 11.5 12.5 13.0 14.0 15.0 6.0 7.0 8.5 10.5 11.0 11.0 11.5 12.5 13.0 4.5 6.0 6.0 6.0 9.5 9.5 ESRtyp Untaped 70 C 10 kHz m pcs./MOQ 7.5 5.3 4.1 4.0 3.9 3.7 3.4 3.2 2.9 2.5 9.2 7.8 5.2 5.0 5.0 4.4 4.3 4.0 3.9 14.4 14.3 8.0 6.5 5.8 5.8 1280 1120 1040 960 960 800 880 800 720 640 1280 1120 960 800 880 800 720 640 640 1280 1120 960 880 640 640
F
mm
VR,85 C = 300 V DC, Vop,70 C = 450 V DC 2.2 11.0 x 19.0 x 31.5 B32674D3225+000 7.5 3.3 12.5 x 21.5 x 31.5 B32674D3335+000 9.0 4.7 14.0 x 24.5 x 31.5 B32674D3475+000 11.0 5.0 15.0 x 24.5 x 31.5 B32674D3505+000 11.0 5.6 15.0 x 24.5 x 31.5 B32674D3565+000 11.5 6.8 18.0 x 27.5 x 31.5 B32674D3685+000 12.5 8.0 16.0 x 32.0 x 31.5 B32674D3805+000 13.5 8.2 18.0 x 33.0 x 31.5 B32674D3825+000 14.0 10 21.0 x 31.0 x 31.5 B32674D3106+000 15.0 12 21.0 x 31.0 x 31.5 B32674D3126+000 16.0 VR,85 C = 450 V DC, Vop,70 C = 630 V DC 1.5 11.0 x 19.0 x 31.5 B32674D4155+000 6.5 2.2 12.5 x 21.5 x 31.5 B32674D4225+000 8.0 3.3 15.0 x 24.5 x 31.5 B32674D4335+000 9.5 4.7 18.0 x 27.5 x 31.5 B32674D4475+000 11.5 5.0 16.0 x 32.0 x 31.5 B32674D4505+000 12.0 5.6 18.0 x 33.0 x 31.5 B32674D4565+000 12.5 6.0 21.0 x 31.0 x 31.5 B32674D4605+000 13.0 6.8 22.0 x 36.5 x 31.5 B32674D4685+000 14.0 7.5 22.0 x 36.5 x 31.5 B32674D4755+000 15.0 VR,85 C = 630 V DC, Vop,70 C = 800 V DC 1.0 11.0 x 19.0 x 31.5 B32674D6105+000 5.0 1.5 12.5 x 21.5 x 31.5 B32674D6155+000 6.5 2.2 15.0 x 24.5 x 31.5 B32674D6225+000 7.0 3.3 16.0 x 32.0 x 31.5 B32674D6335+000 7.0 4.7 22.0 x 36.5 x 31.5 B32674D6475+000 9.5 5.0 22.0 x 36.5 x 31.5 B32674D6505+000 10.5 MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request.
Composition of ordering code + = Capacitance tolerance code: K = 10% J = 5%
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 MKP DC link high power series
Ordering codes and packing units (lead spacing 27.5 mm) CR Max. dimensions wxhxl mm P1 Ordering code (composition see below) IRMS,max 70 C 10 kHz A 5.0 6.0 7.5 9.0 10.0 11.0 5.0 6.0 7.5 7.0 10.0 11.0 IRMS,max 70 C 20 kHz A 4.5 5.5 6.0 7.5 9.0 10.0 4.5 5.5 6.0 6.5 9.0 10.0 ESRtyp Untaped 70 C 10 kHz m pcs./MOQ 23.3 12.4 9.5 6.6 6.0 5.6 22.9 18.6 13.6 8.5 5.1 6.8 1280 1120 1040 800 720 640 1280 1280 1040 800 800 640
F
mm
VR,85 C = 750 V DC, Vop,70 C = 900 V DC 0.68 11.0 x 19.0 x 31.5 B32674D1684+000 1.0 12.5 x 21.5 x 31.5 B32674D1105+000 1.5 14.0 x 24.5 x 31.5 B32674D1155+000 2.2 18.0 x 27.5 x 31.5 B32674D1225+000 3.3 21.0 x 31.0 x 31.5 B32674D1335+000 4.0 22.0 x 36.5 x 31.5 B32674D1405+000 VR,85 C = 875 V DC, Vop,70 C = 1050 V DC 0.47 11.0 x 19.0 x 31.5 B32674D8474+000 0.68 11.0 x 21.0 x 31.5 B32674D8684+000 1.0 13.5 x 23.0 x 31.5 B32674D8105+000 1.5 18.0 x 27.5 x 31.5 B32674D8155+000 2.2 18.0 x 33.0 x 31.5 B32674D8225+000 3.0 22.0 x 36.5 x 31.5 B32674D8305+000
MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request.
Composition of ordering code + = Capacitance tolerance code: K = 10% J = 5%
Please read Cautions and warnings and Important notes at the end of this document.
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B32676 MKP DC link high power series
Ordering codes and packing units (lead spacing 37.5 mm) CR Max. dimensions wxhxl mm P1 Ordering code (composition see below) IRMS,max 70 C 10 kHz A 15.0 15.5 16.0 16.5 17.0 18.0 11.5 12.5 14.0 16.0 18.0 10.0 10.0 10.5 11.0 11.5 12.0 15.0 11.0 11.5 12.5 14.0 15.0 19.5 IRMS,max 70 C 20 kHz A 14.0 14.5 15.0 15.5 16.0 17.0 10.0 11.0 13.0 15.0 17.0 9.5 9.5 10.0 10.5 11.0 11.5 14.0 10.0 10.5 11.5 13.0 14.0 19.0 ESRtyp Untaped 70 C 10 kHz m pcs./MOQ 3.2 2.7 2.6 2.4 2.3 1.5 8.8 7.3 5.0 4.0 1.5 7.1 6.7 6.2 5.7 5.5 3.6 2.3 7.8 7.1 6.7 6.0 5.8 2.7 640 440 440 440 400 192 640 640 440 400 192 640 640 440 440 440 400 192 640 640 440 440 400 192
F
mm
VR,85 C = 300 V DC, Vop,70 C = 450 V DC 15 20.0 x 39.5 x 42.0 10.2 B32676G3156+000 20 28.0 x 37.0 x 42.0 10.2 B32676G3206+000 22 28.0 x 42.5 x 42.0 20.3 B32676G3226+000 25 28.0 x 42.5 x 42.0 20.3 B32676G3256+000 30 30.0 x 45.0 x 42.0 20.3 B32676G3306+000 35 33.0 x 48.0 x 42.0 20.3 B32676G3356+000 VR,85 C = 450 V DC, Vop,70 C = 630 V DC 8.2 20.0 x 39.5 x 42.0 10.2 B32676G4825+000 10 20.0 x 39.5 x 42.0 10.2 B32676G4106+000 15 28.0 x 42.5 x 42.0 10.2 B32676G4156+000 20 30.0 x 45.0 x 42.0 20.3 B32676G4206K000 25 33.0 x 48.0 x 42.0 20.3 B32676G4256K000 VR,85 C = 630 V DC, Vop,70 C = 800 V DC 6.8 20.0 x 39.5 x 42.0 10.2 B32676G6685+000 7.5 20.0 x 39.5 x 42.0 10.2 B32676G6755+000 8.2 28.0 x 37.0 x 42.0 10.2 B32676G6825+000 10 28.0 x 42.5 x 42.0 20.3 B32676G6106+000 12 28.0 x 42.5 x 42.0 20.3 B32676G6126+000 14 30.0 x 45.0 x 42.0 20.3 B32676G6146+000 15 33.0 x 48.0 x 42.0 20.3 B32676G6156+000 VR,85 C = 750 V DC, Vop,70 C = 900 V DC 4.7 20.0 x 39.5 x 42.0 10.2 B32676G1475+000 5.6 20.0 x 39.5 x 42.0 10.2 B32676G1565+000 6.8 28.0 x 37.0 x 42.0 20.3 B32676G1685+000 9.0 28.0 x 42.5 x 42.0 20.3 B32676G1905+000 10 30.0 x 45.0 x 42.0 20.3 B32676G1106+000 12 33.0 x 48.0 x 42.0 20.3 B32676G1126+000
MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request.
Composition of ordering code + = Capacitance tolerance code: K = 10% J = 5%
Please read Cautions and warnings and Important notes at the end of this document.
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B32676 MKP DC link high power series
Ordering codes and packing units (lead spacing 37.5 mm) CR Max. dimensions wxhxl mm P1 Ordering code (composition see below) IRMS,max 70 C 10 kHz A 11.0 11.5 12.5 14.0 15.0 19.5 IRMS,max 70 C 20 kHz A 10.0 10.5 11.5 13.0 14.0 19.0 ESRtyp Untaped 70 C 10 kHz m pcs./MOQ 11.0 9.8 8.6 8.3 8.0 3.7 640 640 440 440 400 192
F
mm
VR,85 C = 875 V DC, Vop,70 C = 1050 V DC 3.3 20.0 x 39.5 x 42.0 10.2 B32676G8335+000 4.0 20.0 x 39.5 x 42.0 10.2 B32676G8405+000 4.7 28.0 x 37.0 x 42.0 20.3 B32676G8475+000 6.8 28.0 x 42.5 x 42.0 20.3 B32676G8685+000 7.5 30.0 x 45.0 x 42.0 20.3 B32676G8755+000 10 33.0 x 48.0 x 42.0 20.3 B32676G8106K000
MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request.
Composition of ordering code + = Capacitance tolerance code: K = 10% J = 5%
Please read Cautions and warnings and Important notes at the end of this document.
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B32678 MKP DC link high power series
Ordering codes and packing units (lead spacing 52.5 mm) CR Max. dimensions wxhxl mm P1 Ordering code (composition see below) IRMS,max 70 C 10 kHz A 19.0 21.0 23.0 19.5 21.0 22.0 17.5 20.0 20.0 21.0 21.0 IRMS,max 70 C 20 kHz A 18.0 20.0 22.0 18.5 20.0 21.0 16.5 19.0 19.5 20.0 20.0 ESRtyp Untaped 70 C 10 kHz m pcs./MOQ 1.9 1.7 1.6 2.1 1.7 1.5 2.9 2.6 3.7 2.6 3.4 280 108 108 108 108 108 108 108 280 108 108
F
mm
VR,85 C = 300 V DC, Vop,70 C = 450 V DC 40 30.0 x 45.0 x 57.5 20.3 B32678G3406+000 47 35.0 x 50.0 x 57.5 20.3 B32678G3476+000 60 35.0 x 50.0 x 57.5 20.3 B32678G3606K000 VR,85 C = 450 V DC, Vop,70 C = 630 V DC 30 35.0 x 50.0 x 57.5 20.3 B32678G4306+000 35 35.0 x 50.0 x 57.5 20.3 B32678G4356+000 40 35.0 x 50.0 x 57.5 20.3 B32678G4406K000 VR,85 C = 630 V DC, Vop,70 C = 800 V DC 20 35.0 x 50.0 x 57.5 20.3 B32678G6206+000 25 35.0 x 50.0 x 57.5 20.3 B32678G6256+000 VR,85 C = 750 V DC, Vop,70 C = 900 V DC 15 30.0 x 45.0 x 57.5 20.3 B32678G1156K000 20 35.0 x 50.0 x 57.5 20.3 B32678G1206K000 VR,85 C = 875 V DC, Vop,70 C = 1050 V DC 15 35.0 x 50.0 x 57.5 20.3 B32678G8156K000
MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request.
Composition of ordering code + = Capacitance tolerance code: K = 10% J = 5%
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Technical data Reference standard: IEC 61071. All data given at T = 20 C, unless otherwise specified. Max. operating temperature, Top,max +105 C Operating temperature range (case) Upper category temperature Tmax +100 C Lower category temperature Tmin -40 C LS 27.5 < 3.0 ESRtyp ESR (at 10 kHz) LS 37.5 < 2.5 ESRtyp LS 52.5 < 1.5 ESRtyp Insulation Resistance Rins 30 000 s given as time constant t= CR Rins, rel. humidity 65% (minimum as-delivered values) DC test voltage between terminals (10 s) 1.5 VR DC test voltage terminal to case (10 s) 2110 V AC, 50 Hz Maximum peak current (A) Damp heat test Limit values after damp heat test 56 days/40 C/93% relative humidity Capacitance change | C/C | 5% Dissipation factor change tan 1.5 * 10-3 (at 1 kHz) 50% of minimum Insulation resistance Rins as-delivered values 1 fit ( 1 10-9/h) at 0.5 VR, 40 C 200 000 h at VR, 85 C For conversion to other operating conditions and temperatures, refer to chapter "Quality, 2 Reliability". 300 450 300 450 450 630 450 675 630 800 630 950 750 900 750 1125 875 1050 875 1300
Reliability:
Failure rate Service life tSL
VR (V DC) Continuous operation voltage Vop (V DC) at 70 C Continuous operation voltage Vop (V DC) at 85 C Maximum peak voltage VP,max (V DC) For temperatures between 85 C and 100 C
1.2%/C of derating respect Vop at 85 C
Please read Cautions and warnings and Important notes at the end of this document.
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Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/s. Note: The values of dV/dt provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt values Lead spacing Type VR (V DC) CR (F) 0.47 0.68 1.0 1.5 2.2 3.0 3.3 4.0 4.7 5.0 5.6 6.0 6.8 7.5 8.0 8.2 9.0 10 12 14 15 20 22 25 30 35 40 47 60 27.5 mm 37.5 mm 52.5 mm B32674 B32676 B32678 300 450 630 750 875 300 450 630 750 875 300 450 630 750 875 dV/dt in V/s 150 125 150 100 125 150 75 100 125 150 40 75 100 125 150 40 150 40 75 100 125 100 125 100 40 75 100 85 100 40 75 100 40 75 85 75 75 73 85 100 75 73 100 54 54 73 73 73 73 73 85 85 100 85 60 60 70
22 22 22 22 22 22
54 54 54
50 50 35 35 35
15 15 15
Please read Cautions and warnings and Important notes at the end of this document.
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ESL values ESL 2-pin 4-pin Typical waveforms 25 nH 17 nH
Restrictions: VR: Maximum operating peak voltage of either polarity but of a non-reversing waveform, for which the capacitor has been designed for continuous operation. VR AC 0.2 VP, max: Maximum permissible recurrent voltage that may appear for 2% of the period.
Please read Cautions and warnings and Important notes at the end of this document.
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Mounting guidelines 1 1.1 Soldering Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature Soldering time Immersion depth Evaluation criteria: Visual inspection 1.2 235 5 C 2.0 0.5 s 2.0 +0/ 0.5 mm from capacitor body or seating plane Wetting of wire surface by new solder 90%, free-flowing solder
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A. Conditions: Series Solder bath temperature Soldering time 10 1 s
MKT boxed (except 2.5 x 6.5 x 7.2 mm) 260 5 C coated uncoated (lead spacing > 10 mm) MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 x 6.5 x 7.2 mm) MKP (lead spacing 7.5 mm) MKT uncoated (lead spacing 10 mm) insulated (B32559)
5 1 s <4s recommended soldering profile for MKT uncoated (lead spacing 10 mm) and insulated (B32559)
Please read Cautions and warnings and Important notes at the end of this document.
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Immersion depth Shield Evaluation criteria: Visual inspection C/C0 tan
2.0 +0/ 0.5 mm from capacitor body or seating plane Heat-absorbing board, (1.5 0.5) mm thick, between capacitor body and liquid solder No visible damage 2% for MKT/MKP/MFP 5% for EMI suppression capacitors As specified in sectional specification
Please read Cautions and warnings and Important notes at the end of this document.
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1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommends the following conditions: Pre-heating with a maximum temperature of 110 C Temperature inside the capacitor should not exceed the following limits: MKP/MFP 110 C MKT 160 C When SMD components are used together with leaded ones, the leaded film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. Uncoated capacitors For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following measures are recommended: pre-heating to not more than 110 C in the preheater phase rapid cooling after soldering
Please read Cautions and warnings and Important notes at the end of this document.
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2
Cleaning
To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below: Type Ethanol, isopropanol, n-propanol n-propanol-water mixtures, water with surface tension-reducing tensides (neutral) Unsuitable Suitable Solvent from table A (see next page) Solvent from table B (see next page)
MKT (uncoated) MKT, MKP, MFP (coated/boxed)
Suitable
In part suitable Unsuitable Suitable
Even when suitable solvents are used, a reversible change of the electrical characteristics may occur in uncoated capacitors immediately after they are washed. Thus it is always recommended to dry the components (e.g. 4 h at 70 C) before they are subjected to subsequent electrical testing. Table A Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection) Trifluoro-trichloroethane Freon TF Frigen 113 TR Arklone P Kaltron 113 MDR Flugene 113 Mixtures of trifluoro-trichloro-ethane with ethanol and isopropanol Freon TE 35; Freon TP 35; Freon TES Frigen 113 TR-E; Frigen 113 TR-P; Frigen TR-E 35 Arklone A; Arklone L; Arklone K Kaltron 113 MDA; Kaltron 113 MDI; Kaltron 113 MDI 35 Flugene 113 E; Flugene 113 IPA Manufacturer Du Pont Hoechst ICI Kali-Chemie Rhone-Progil
Table B (worldwide banned substances) Manufacturers' designations for unsuitable cleaning solvents (selection) Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons Freon TMC; Freon TA; Freon TC Arklone E Kaltron 113 MDD; Kaltron 113 MDK Flugene 113 CM Manufacturer Du Pont ICI Kali-Chemie Rhone-Progil
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account. Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 C. Caution: Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". Topic Safety information Reference chapter "General technical information" Make sure that capacitors are stored within the 4.5 specified range of time, temperature and humidity "Storage conditions" conditions. Avoid external energy, such as fire or electricity 5.3 (passive flammability), avoid overload of the "Flammability" capacitors (active flammability) and consider the flammability of materials. Do not exceed the tested ability to withstand 5.2 vibration. The capacitors are tested to "Resistance to vibration" IEC 60068-2-6. EPCOS offers film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics".
Storage conditions
Flammability
Resistance to vibration
Please read Cautions and warnings and Important notes at the end of this document.
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Topic Soldering
Safety information
Do not exceed the specified time or temperature limits during soldering. Cleaning Use only suitable solvents for cleaning capacitors. Embedding of When embedding finished circuit assemblies in capacitors in plastic resins, chemical and thermal influences finished assemblies must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types!
Reference chapter "Mounting guidelines" 1 "Soldering" 2 "Cleaning" 3 "Embedding of capacitors in finished assemblies"
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Symbols and terms Symbol C A C C CR C C/C C/CR dt t T tan V dV/dt V/t E ESL ESR f f1 English Heat transfer coefficient Temperature coefficient of capacitance Capacitor surface area Humidity coefficient of capacitance Capacitance Rated capacitance Absolute capacitance change Relative capacitance change (relative deviation of actual value) Capacitance tolerance (relative deviation from rated capacitance) Time differential Time interval Absolute temperature change (self-heating) Absolute change of dissipation factor Absolute voltage change Time differential of voltage function (rate of voltage rise) Voltage change per time interval Activation energy for diffusion Self-inductance Equivalent series resistance Frequency Frequency limit for reducing permissible AC voltage due to thermal limits German Warmeubergangszahl Temperaturkoeffizient der Kapazitat Kondensatoroberflache Feuchtekoeffizient der Kapazitat Kapazitat Nennkapazitat Absolute Kapazitatsanderung Relative Kapazitatsanderung (relative Abweichung vom Ist-Wert) Kapazitatstoleranz (relative Abweichung vom Nennwert) Differentielle Zeit Zeitintervall Absolute Temperaturanderung (Selbsterwarmung) Absolute Anderung des Verlustfaktors Absolute Spannungsanderung Differentielle Spannungsanderung (Spannungsflankensteilheit) Spannungsanderung pro Zeitintervall Aktivierungsenergie zur Diffusion Eigeninduktivitat Ersatz-Serienwiderstand Frequenz Grenzfrequenz fur thermisch bedingte Reduzierung der zulassigen Wechselspannung Frequency limit for reducing permissible Grenzfrequenz fur strombedingte AC voltage due to current limit Reduzierung der zulassigen Wechselspannung Resonant frequency Resonanzfrequenz Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur Diffusion Derating factor Deratingfaktor Current (peak) Stromspitze Category current (max. continuous Kategoriestrom (max. Dauerstrom) current)
f2
fr FD FT i IC
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Symbol IRMS iz k0 LS 0 test Pdiss Pgen Q R R Ri Rins RP RS S t T tan tan D tan P tan S TA Tmax Tmin tOL Top TR Tref tSL VAC
English (Sinusoidal) alternating current, root-mean-square value Capacitance drift Pulse characteristic Series inductance Failure rate Constant failure rate during useful service life Failure rate, determined by tests Dissipated power Generated power Heat energy Density of water vapor in air Universal molar constant for gases Ohmic resistance of discharge circuit Internal resistance Insulation resistance Parallel resistance Series resistance severity (humidity test) Time Temperature Time constant Dissipation factor Dielectric component of dissipation factor Parallel component of dissipation factor Series component of dissipation factor Ambient temperature Upper category temperature Lower category temperature Operating life at operating temperature and voltage Operating temperature Rated temperature Reference temperature Reference service life AC voltage
German (Sinusformiger) Wechselstrom Inkonstanz der Kapazitat Impulskennwert Serieninduktivitat Ausfallrate Konstante Ausfallrate in der Nutzungsphase Experimentell ermittelte Ausfallrate Abgegebene Verlustleistung Erzeugte Verlustleistung Warmeenergie Dichte von Wasserdampf in Luft Allg. Molarkonstante fur Gas Ohmscher Widerstand des Entladekreises Innenwiderstand Isolationswiderstand Parallelwiderstand Serienwiderstand Scharfegrad (Feuchtetest) Zeit Temperatur Zeitkonstante Verlustfaktor Dielektrischer Anteil des Verlustfaktors Parallelanteil des Verlfustfaktors Serienanteil des Verlustfaktors Umgebungstemperatur Obere Kategorietemperatur Untere Kategorietemperatur Betriebszeit bei Betriebstemperatur und -spannung Beriebstemperatur Nenntemperatur Referenztemperatur Referenz-Lebensdauer Wechselspannung
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Symbol VC VC,RMS VCD Vch VDC VFB Vi Vo Vop Vp Vpp VR
R
English Category voltage Category AC voltage Corona-discharge onset voltage Charging voltage DC voltage Fly-back capacitor voltage Input voltage Output voltage Operating voltage Peak pulse voltage Peak-to-peak voltage Impedance Rated voltage Amplitude of rated AC voltage (Sinusoidal) alternating voltage, root-mean-square value S-correction voltage Snubber capacitor voltage Impedance Lead spacing
German Kategoriespannung (Sinusformige) Kategorie-Wechselspannung Teilentlade-Einsatzspannung Ladespannung Gleichspannung Spannung (Flyback) Eingangsspannung Ausgangssspannung Betriebsspannung Impuls-Spitzenspannung Spannungshub Nennspannung Amplitude der Nenn-Wechselspannung (Sinusformige) Wechselspannung Spannung bei Anwendung "S-correction" Spannung bei Anwendung "Beschaltung" Scheinwiderstand Rasterma
VRMS VSC Vsn Z
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Mounting guidelines 1 1.1 Soldering Solderability of leads
The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature Soldering time Immersion depth Evaluation criteria: Visual inspection 1.2 235 5 C 2.0 0.5 s 2.0 +0/ 0.5 mm from capacitor body or seating plane Wetting of wire surface by new solder 90%, free-flowing solder
Resistance to soldering heat
Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A. Conditions: Series Solder bath temperature Soldering time 10 1 s
MKT boxed (except 2.5 x 6.5 x 7.2 mm) 260 5 C coated uncoated (lead spacing > 10 mm) MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 x 6.5 x 7.2 mm) MKP (lead spacing 7.5 mm) MKT uncoated (lead spacing 10 mm) insulated (B32559)
5 1 s <4s recommended soldering profile for MKT uncoated (lead spacing 10 mm) and insulated (B32559)
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B32674 ... B32678 MKP DC link high power series
Immersion depth Shield Evaluation criteria: Visual inspection C/C0 tan
2.0 +0/ 0.5 mm from capacitor body or seating plane Heat-absorbing board, (1.5 0.5) mm thick, between capacitor body and liquid solder No visible damage 2% for MKT/MKP/MFP 5% for EMI suppression capacitors As specified in sectional specification
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B32674 ... B32678 MKP DC link high power series
1.3
General notes on soldering
Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommends the following conditions: Pre-heating with a maximum temperature of 110 C Temperature inside the capacitor should not exceed the following limits: MKP/MFP 110 C MKT 160 C When SMD components are used together with leaded ones, the leaded film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. Uncoated capacitors For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following measures are recommended: pre-heating to not more than 110 C in the preheater phase rapid cooling after soldering
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
2
Cleaning
To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below: Type Ethanol, isopropanol, n-propanol n-propanol-water mixtures, water with surface tension-reducing tensides (neutral) Unsuitable Suitable Solvent from table A (see next page) Solvent from table B (see next page)
MKT (uncoated) MKT, MKP, MFP (coated/boxed)
Suitable
In part suitable Unsuitable Suitable
Even when suitable solvents are used, a reversible change of the electrical characteristics may occur in uncoated capacitors immediately after they are washed. Thus it is always recommended to dry the components (e.g. 4 h at 70 C) before they are subjected to subsequent electrical testing. Table A Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection) Trifluoro-trichloroethane Freon TF Frigen 113 TR Arklone P Kaltron 113 MDR Flugene 113 Mixtures of trifluoro-trichloro-ethane with ethanol and isopropanol Freon TE 35; Freon TP 35; Freon TES Frigen 113 TR-E; Frigen 113 TR-P; Frigen TR-E 35 Arklone A; Arklone L; Arklone K Kaltron 113 MDA; Kaltron 113 MDI; Kaltron 113 MDI 35 Flugene 113 E; Flugene 113 IPA Manufacturer Du Pont Hoechst ICI Kali-Chemie Rhone-Progil
Table B (worldwide banned substances) Manufacturers' designations for unsuitable cleaning solvents (selection) Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons Freon TMC; Freon TA; Freon TC Arklone E Kaltron 113 MDD; Kaltron 113 MDK Flugene 113 CM Manufacturer Du Pont ICI Kali-Chemie Rhone-Progil
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
3
Embedding of capacitors in finished assemblies
In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account. Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 C. Caution: Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". Topic Safety information Reference chapter "General technical information" Make sure that capacitors are stored within the 4.5 specified range of time, temperature and humidity "Storage conditions" conditions. Avoid external energy, such as fire or electricity 5.3 (passive flammability), avoid overload of the "Flammability" capacitors (active flammability) and consider the flammability of materials. Do not exceed the tested ability to withstand 5.2 vibration. The capacitors are tested to "Resistance to vibration" IEC 60068-2-6. EPCOS offers film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics".
Storage conditions
Flammability
Resistance to vibration
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B32674 ... B32678 MKP DC link high power series
Topic Soldering
Safety information
Do not exceed the specified time or temperature limits during soldering. Cleaning Use only suitable solvents for cleaning capacitors. Embedding of When embedding finished circuit assemblies in capacitors in plastic resins, chemical and thermal influences finished assemblies must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types!
Reference chapter "Mounting guidelines" 1 "Soldering" 2 "Cleaning" 3 "Embedding of capacitors in finished assemblies"
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B32674 ... B32678 MKP DC link high power series
Symbols and terms Symbol C A C C CR C C/C C/CR dt t T tan V dV/dt V/t E ESL ESR f f1 English Heat transfer coefficient Temperature coefficient of capacitance Capacitor surface area Humidity coefficient of capacitance Capacitance Rated capacitance Absolute capacitance change Relative capacitance change (relative deviation of actual value) Capacitance tolerance (relative deviation from rated capacitance) Time differential Time interval Absolute temperature change (self-heating) Absolute change of dissipation factor Absolute voltage change Time differential of voltage function (rate of voltage rise) Voltage change per time interval Activation energy for diffusion Self-inductance Equivalent series resistance Frequency Frequency limit for reducing permissible AC voltage due to thermal limits German Warmeubergangszahl Temperaturkoeffizient der Kapazitat Kondensatoroberflache Feuchtekoeffizient der Kapazitat Kapazitat Nennkapazitat Absolute Kapazitatsanderung Relative Kapazitatsanderung (relative Abweichung vom Ist-Wert) Kapazitatstoleranz (relative Abweichung vom Nennwert) Differentielle Zeit Zeitintervall Absolute Temperaturanderung (Selbsterwarmung) Absolute Anderung des Verlustfaktors Absolute Spannungsanderung Differentielle Spannungsanderung (Spannungsflankensteilheit) Spannungsanderung pro Zeitintervall Aktivierungsenergie zur Diffusion Eigeninduktivitat Ersatz-Serienwiderstand Frequenz Grenzfrequenz fur thermisch bedingte Reduzierung der zulassigen Wechselspannung Frequency limit for reducing permissible Grenzfrequenz fur strombedingte AC voltage due to current limit Reduzierung der zulassigen Wechselspannung Resonant frequency Resonanzfrequenz Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur Diffusion Derating factor Deratingfaktor Current (peak) Stromspitze Category current (max. continuous Kategoriestrom (max. Dauerstrom) current)
f2
fr FD FT i IC
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Symbol IRMS iz k0 LS 0 test Pdiss Pgen Q R R Ri Rins RP RS S t T tan tan D tan P tan S TA Tmax Tmin tOL Top TR Tref tSL VAC
English (Sinusoidal) alternating current, root-mean-square value Capacitance drift Pulse characteristic Series inductance Failure rate Constant failure rate during useful service life Failure rate, determined by tests Dissipated power Generated power Heat energy Density of water vapor in air Universal molar constant for gases Ohmic resistance of discharge circuit Internal resistance Insulation resistance Parallel resistance Series resistance severity (humidity test) Time Temperature Time constant Dissipation factor Dielectric component of dissipation factor Parallel component of dissipation factor Series component of dissipation factor Ambient temperature Upper category temperature Lower category temperature Operating life at operating temperature and voltage Operating temperature Rated temperature Reference temperature Reference service life AC voltage
German (Sinusformiger) Wechselstrom Inkonstanz der Kapazitat Impulskennwert Serieninduktivitat Ausfallrate Konstante Ausfallrate in der Nutzungsphase Experimentell ermittelte Ausfallrate Abgegebene Verlustleistung Erzeugte Verlustleistung Warmeenergie Dichte von Wasserdampf in Luft Allg. Molarkonstante fur Gas Ohmscher Widerstand des Entladekreises Innenwiderstand Isolationswiderstand Parallelwiderstand Serienwiderstand Scharfegrad (Feuchtetest) Zeit Temperatur Zeitkonstante Verlustfaktor Dielektrischer Anteil des Verlustfaktors Parallelanteil des Verlfustfaktors Serienanteil des Verlustfaktors Umgebungstemperatur Obere Kategorietemperatur Untere Kategorietemperatur Betriebszeit bei Betriebstemperatur und -spannung Beriebstemperatur Nenntemperatur Referenztemperatur Referenz-Lebensdauer Wechselspannung
Please read Cautions and warnings and Important notes at the end of this document.
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B32674 ... B32678 MKP DC link high power series
Symbol VC VC,RMS VCD Vch VDC VFB Vi Vo Vop Vp Vpp VR
R
English Category voltage Category AC voltage Corona-discharge onset voltage Charging voltage DC voltage Fly-back capacitor voltage Input voltage Output voltage Operating voltage Peak pulse voltage Peak-to-peak voltage Impedance Rated voltage Amplitude of rated AC voltage (Sinusoidal) alternating voltage, root-mean-square value S-correction voltage Snubber capacitor voltage Impedance Lead spacing
German Kategoriespannung (Sinusformige) Kategorie-Wechselspannung Teilentlade-Einsatzspannung Ladespannung Gleichspannung Spannung (Flyback) Eingangsspannung Ausgangssspannung Betriebsspannung Impuls-Spitzenspannung Spannungshub Nennspannung Amplitude der Nenn-Wechselspannung (Sinusformige) Wechselspannung Spannung bei Anwendung "S-correction" Spannung bei Anwendung "Beschaltung" Scheinwiderstand Rasterma
VRMS VSC Vsn Z
Please read Cautions and warnings and Important notes at the end of this document.
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Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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